Combo Lids ™
Combo-Lid™ covers deliver superior sealing to protect high reliability applications in semiconductor, MEMS, crystal oscillator, medical and optical devices from moisture and particulates.
The base metal in a Combo-Lid covers is Kovar™ metal (Alloy 42) which is plated with nickel and gold flash and then tack-welded to a solder preform, usually AuSn (gold-tin) eutectic. The nickel layer inhibits corrosion, while the precious metal (gold) layer promotes solderability and ensures a clean particulate-free surface. Tack-welding the solder preform to the lid conveniently aligns the solder to the perimeter of the lid, simplifying handling and reducing part count. Therefore, Hermetic Combo-Lid™ covers offer a best-cost solution.
BENEFITS OF COMBO-LIDS™
- Corrosion Resistance
- Moisture resistance
- Solder preform already attached for ease of assembly
- Brand Marking Permanency
- Hermetic Seal
Glass Lids & Glass Lids with Epoxy
These glass lids are typically made with Schott D-263 glass and come with a B stage epoxy sealant already screened onto the lid.
We currently stock clear glass lids in a variety of sizes. We also offer a variety of glass types and coatings, which are available on a special order basis.
Ceramic Lids with Epoxy & Bare Ceramic
Ceramic Lids are used primarily with Cerquad / Cerdip packages that require a glass or B-staged epoxy coated seal.
They can be used on other various multilayer packages where temperature constraints after die attach require a low temperature lid seal. We also offer lids without sealant for tape on applications. This option provides a lower cost solution where hermeticity is not a requirement.
Advantages:
- Available with low, high temperature sealant or no sealant
- Flat or cupped shape
- Marking permanency